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Cadence Nominated for EDN Magazine Innovation of the Year Award
Cadence Allegro PCB SI 630 High-Capacity Simulation Technology
Selected as Finalist for Prestigious Industry Recognition
SAN JOSE, Calif.—(BUSINESS WIRE)—Jan. 27, 2005—
Cadence Design Systems, Inc. (NYSE:CDN) (Nasdaq:CDN) today
announced that its Cadence(R) Allegro(R) PCB SI 630, the PCB
industry's most advanced solution for multi-GigaHertz (MGH) signal
design, is a finalist in this year's EDN Magazine innovation awards.
Allegro PCB SI 630 features innovative high-capacity simulation
technology that addresses today's most pressing high-speed serial-link
design requirements. Selected from hundreds of applicants, Allegro PCB
SI 630, part of the Allegro system interconnect design platform, is
the only solution on the market with completely integrated S-parameter
support and high-capacity simulation. It leverages a virtual
prototyping environment to shorten design-cycle time for designs with
MGH signals.
"As the saying goes, many are called, but few are chosen. Our
technical editors have done outstanding work on the difficult task of
identifying the finalists. The differences in the products EDN covers
are often subtle and tricky to flush out," said EDN Editor-in-Chief
John Dodge. "Congratulations to all the finalists on a job well done
and see you March 7 in San Francisco"
As data rates increase in multi-gigabit range, design challenges
increase, as does the designer's need to utilize a broader range of
fast and accurate design tools. The Allegro PCB SI 630 is the only
solution able to simulate 10 million bits for MGH signals in a couple
of hours. This becomes increasing important with serial links designed
for standards such as, PCI Express, Serial ATA, and ATCA. "With long
channel propagation delays, frequency dependent losses, and reflection
coefficients, meaningful eye closure measurements can only be
performed with exhaustive data patterns," said Kevin Roselle, chief
technology officer at Bayside Design Inc. "Until now, no simulation
tool could simulate tens of thousands of bits of data with
realistically coded data patterns. Allegro PCB SI 630 allows engineers
to get as complete a picture they are used to getting with
oscilloscopes."
"We are very proud to be among the finalists for the 15th annual
EDN Innovation of the Year awards," said Charlie Giorgetti, corporate
vice president and general manager of the silicon-package-board
business unit at Cadence. "Allegro PCB SI 630 improves productivity
and time to market by helping designers avoid silicon that is
difficult or expensive to implement into a system."
EDN readers are encouraged to vote online for their favorite
products and technologies from among the finalists. Online voting
takes place at www.edn.com from Jan. 13 through Feb. 1.
About Cadence
Cadence is the world's largest supplier of electronic design
technologies and engineering services. Cadence products and services
are used to accelerate and manage the design of semiconductors,
computer systems, networking equipment, telecommunications equipment,
consumer electronics, and other electronics-based products. With
approximately 4,850 employees and 2003 revenues of approximately $1.1
billion, Cadence has sales offices, design centers, and research
facilities around the world. The company is headquartered in San Jose,
Calif., and trades on both the New York Stock Exchange and Nasdaq
under the symbol CDN. More information is available at
www.cadence.com.
Cadence, the Cadence logo, and Allegro are registered trademarks
of Cadence Design Systems in the United States and other countries.
All other trademarks are the property of their respective owners.
Contact:
Cadence Design Systems, Inc.
Judy Erkanat, 408-894-2302
jerkanat@cadence.com
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